SILICON RECLAIM
INSPIRE TECHNOLOGIES, INC. has recently acquired Von-Ruse Silicon, the
oldest and most experienced silicon wafer reclaimer in the world with over 27
years of experience in satisfying the needs of its customers. With our
commitment to excellence and customer satisfaction along with a realistic sense
of business conduct and practice, INSPIRE TECHNOLOGIES, INC. is a potent
contender in today's market place. Poised for the next surge of business
growth, we are ready for the future with updated equipment and technology which
will make INSPIRE TECHNOLOGIES, INC. second to none in our abilities to
provide competitively priced services for future demands.
INSPIRE TECHNOLOGIES, INC.
has fifteen thousand square feet of commercial building space which houses three
class 10 clean rooms. Our experienced and knowledgeable expertise is
founded in its qualified and dedicated personnel.
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State of the art polishers featuring Strausbaugh 6DS SP CMP Planarization
polishers which automatically process each wafer with cassette to cassette
reliability, both rough and final polish are accomplished on this one
tool. This is the top of the line machine for reclaim and process
technology which the silicon reclaim industry demands.
The mainstay of the
polishing business is founded on eight Siltec polishers which have been
renovated and maintained for the demanding reclaim business. Strausbaugh
final polishers finish off the line to clean and touch up on the silicon wafer
after the Siltec polishers. This makes the wafers ready for final clean
and inspection.
The clean room features 4 Megasonic cleaning tools which remove particles as small as .12um. Process
chemistry baths with temperature and particle control carefully maintain the
environment for the desired results. Three clean room dryers and one new
TEL scrubber/dryer remove the remaining trace contaminants while providing a dry
wafer.
The wafer moves on to a
Wafer Inspection System tool which qualifies each wafer with 100% inspection
accuracy. Defects as small as .12um are detectable with the two WIS
machines. For future use, an Ultra Point Laser Imaging Tool has been added
with 20,000 times optical magnification and .15um laser imaging capability.
The qualified parts are now sent to packaging where they are sealed and bagged
in double enclosures. |
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Prior to any polish, the
wafers are inspected and categorized for thickness, resistivity and type.
The lab area classifies each and every wafer and a computerized tracking system
follows the products through the complete cycle. Wafers needing etch are
sent to our internal etch facility which thoroughly cleans and conditions the
wafer.
For specialized products,
we offer a back process which is a company secret. This process provides a
stain free pure silicon mat finish free of oxides, nitrides, and other
contaminants.
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